Wednesday, March 30, 2011

IUTAM Symposium on Anisotropy, Inhomogeneity and Nonlinearity in Solid Mechanics (Solid Mechanics and Its Applications)

IUTAM Symposium on Anisotropy, Inhomogeneity and Nonlinearity in Solid Mechanics (Solid Mechanics and Its Applications) Review


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IUTAM Symposium on Anisotropy, Inhomogeneity and Nonlinearity in Solid Mechanics (Solid Mechanics and Its Applications) Feature

The proceedings of the IUTAM Symposium on Anisotropy, Inhomogeneity and Nonlinearity in Solid Mechanics contains 69 papers by acknowledged experts covering recent research in this field of solid mechanics. The material has been grouped into eight sections: Characterisation of Anisotropic Materials; Large Deformations and Flow; Numerical Studies in Plasticity; Plasticity and Granular Materials; Fracture and Damage; Anisotropic Media; Composite Materials; Waves and Vibrations. Individual papers cover analytical methods, experimental and/or numerical techniques which may be applied to static or dynamic problems for anisotropic media.
Audience: Those engaged in developing, modelling and testing modern composite, laminated or inhomogeneous materials will find their current problems discussed by experts.


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Tuesday, March 29, 2011

Geometric Tolerances: Impact on Product Design, Quality Inspection and Statistical Process Monitoring

Geometric Tolerances: Impact on Product Design, Quality Inspection and Statistical Process Monitoring Review


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Geometric Tolerances: Impact on Product Design, Quality Inspection and Statistical Process Monitoring Feature

Geometric tolerances are changing the way we design and manufacture industrial products. Geometric Tolerances covers their impact on the world of design and production, highlighting new perspectives, possibilities, current issues and future challenges. The topics covered are designed to be relevant to readers from a variety of backgrounds, ranging from product designers and manufacturers to quality inspection engineers and quality engineers involved in statistical process monitoring. Areas included are: • selection of appropriate geometric tolerances and how they stack up in assembled products; • inspection of parts subjected to geometric tolerancing from the macro to the micro and sub-micro scales; and • enhancement of efficiency and efficacy of quality monitoring. Geometric Tolerances provides the reader with the most recent scientific research in the field, as well as with a significant amount of real-life industrial case studies, delivering a multidisciplinary, synoptic view of one of the hottest and most strategic topics in industrial production.


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Monday, March 28, 2011

Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006

Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 Review


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Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 Feature

The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).


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Sunday, March 27, 2011

IUTAM Symposium on Chaotic Dynamics and Control of Systems and Processes in Mechanics: Proceedings of the IUTAM Symposium held in Rome, Italy, 8-13 June 2003 (Solid Mechanics and Its Applications)

IUTAM Symposium on Chaotic Dynamics and Control of Systems and Processes in Mechanics: Proceedings of the IUTAM Symposium held in Rome, Italy, 8-13 June 2003 (Solid Mechanics and Its Applications) Review


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IUTAM Symposium on Chaotic Dynamics and Control of Systems and Processes in Mechanics: Proceedings of the IUTAM Symposium held in Rome, Italy, 8-13 June 2003 (Solid Mechanics and Its Applications) Feature

The interest of the applied mechanics community towards chaotic dynamics of engineering systems has exploded in the last fifteen years. Today, it is generally accepted that nonlinear vibration problems of advanced systems should be addressed through the combined use of analytical, computational, geometrical and experimental approaches, by paying also attention to the interaction with control features.

The outstanding points of these proceedings are a coherent compendium of the current state of theory and applications of nonlinear and chaotic dynamics in mechanics, along with their control. Subject areas include: Bifurcation and chaos, mechanical and structural systems, nonsmooth dynamics, delay and random systems, control of systems and processes, synchronization and control of chaos.

Major achievements are highlighted as regards: Complex systems and processes for classical and innovative applications, features of nonlinear interactions, patterns of novel bifurcations of non-smooth systems, dimensionality and reduced-order models of continuous systems, exploitation of dynamical systems properties for applications, implications of chaos for design and operating conditions, control of spatio-temporal dynamics.


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Friday, March 25, 2011

Mechanics of Microelectronics (Solid Mechanics and Its Applications)

Mechanics of Microelectronics (Solid Mechanics and Its Applications) Review


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Mechanics of Microelectronics (Solid Mechanics and Its Applications) Feature

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.


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Thursday, March 24, 2011

Structures Technology for Future Aerospace Systems (Progress in Astronautics and Aeronautics)

Structures Technology for Future Aerospace Systems (Progress in Astronautics and Aeronautics) Review


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Structures Technology for Future Aerospace Systems (Progress in Astronautics and Aeronautics) Feature

This volume focuses on the component technologies that will play a major role in structures technology for future aerospace systems. Contributors use case histories to demonstrate the technology's development and carry it through to the current state of the art. Each chapter describes current capabilities, deficiencies and barriers; current research activities; future directions of development; and applicability of the technology in the future - both near and far term.


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Wednesday, March 23, 2011

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Review


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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Feature

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-

  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.


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  • Tuesday, March 22, 2011

    Security and Reliability of Damaged Structures and Defective Materials (NATO Science for Peace and Security Series C: Environmental Security)

    Security and Reliability of Damaged Structures and Defective Materials (NATO Science for Peace and Security Series C: Environmental Security) Review


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    Security and Reliability of Damaged Structures and Defective Materials (NATO Science for Peace and Security Series C: Environmental Security) Feature

    Structures that are essential for economy and security such as energy production, transportation and supply, water supply, buildings, are susceptible to failure, because of defects already present in the material, or created at fabrication, or appearing during service. Methods of assesment of the nocivity of these defects are needed, to predict the remaining service life and the eventual emergency of stopping service and repairing, if possible. To reach this objectives, this book presents the last methods derived from the classical linear, non-linear fracture mechanics concepts, including fatigue and notch fracture mechanics. Several examples of structures rehabilitations and repairing are given. This book gathers the presentation made during the Advanced Research Workshop held in Portoroz (Slovenia) in October 2008, under the auspices of NATO Science for Peace and Security Programme. It is edited by Professor Guy Pluvinage from the University Paul Verlaine – Metz (France) and Professor Aleksandar Sedmak from the University of Belgrade, Faculty of Mechanical Engineering. Both have a long and rich experience in analysis of theoretical and practical cases in safety and reliability of structures. Other contributors are all known as experts in the areas of fatigue, facture and reliability of structures.


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    Sunday, March 20, 2011

    Team Building (Technical Manager's Survival Guides)

    Team Building (Technical Manager's Survival Guides) Review


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    Team Building (Technical Manager's Survival Guides) Feature


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    Saturday, March 19, 2011

    Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

    Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) Review


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    Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) Feature

    This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
    It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.


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