Encyclopedia of Environmental Control Technology: Volume 1:: Thermal Treatment of Hazardous Wastes Review
Showing posts with label thermal. Show all posts
Showing posts with label thermal. Show all posts
Monday, August 22, 2011
Tuesday, July 26, 2011
Solar Energy: Principles of Thermal Collection and Storage, 3e
Solar Energy: Principles of Thermal Collection and Storage, 3e Review
Solar Energy: Principles of Thermal Collection and Storage, 3e Feature
"The revision of this text hallmark text on Solar Energy has been done keeping in mind the current scenario in Solar Energy requirements. As a result the book is updated with the energy scenario and the various applications of solar energy being used today. Numerous new topics comparison tables solved and unsolved problems, have been added and changes have been made to cater to the changing requirements of the students. In all it is the most updated and comprehensive yet concise book on the subject. "
Rerate Products
Customer Review
Saturday, May 14, 2011
Thermal Stresses -- Advanced Theory and Applications (Solid Mechanics and Its Applications)
Thermal Stresses -- Advanced Theory and Applications (Solid Mechanics and Its Applications) Review
Thermal Stresses -- Advanced Theory and Applications (Solid Mechanics and Its Applications) Feature
This text on Thermal Stresses covers linear and non-linear problems and offers a chapter on Creep Analysis due to Thermal Stresses. It also contains numerous applications, solved problems in the text, and problems at the end of each chapter.
Rerate Products
Customer Review
Friday, May 13, 2011
Developments in the Design of Thermal Systems
Developments in the Design of Thermal Systems Review
Developments in the Design of Thermal Systems Feature
As the cost and complexity of designing thermal systems have increased, the need to understand and improve the design process has also grown. This book describes recent progress. The book begins with a brief history and outline of developments in thermal system design. Chapters then discuss computer design tools for the power and chemical industries, predicting physical properties with computational tools, "pinch analysis" to improve thermal efficiency, applications of the energy concept, thermoeconomics, and the potential for artificial intelligence and expert systems in the design of thermal systems. With chapters written by internationally recognized authorities, the book offers a state-of-the-art review for both researchers and practitioners in mechanical, aerospace, chemical, and power engineering.
Rerate Products
Customer Review
Sunday, April 24, 2011
Thermal Stresses IV
Thermal Stresses IV Review
Thermal Stresses IV Feature
This is the fourth volume of the handbook Thermal Stresses. Following the principles established when the first volume was published in 1986, the fourth volume consists of six separate chapters prepared by specialists in the field. Each chapter is devoted to a different topic in the area of Thermal Stresses. Many results have been published for the first time in Thermal Stresses IV. The exposition of the material is on the state-of-the art level, which should be appropriate for graduate students, researchers, and engineers specializing in the field of stress analysis. In most cases the material is presented with some historical perspective. A large number of references provided will allow the readers to augment their knowledge, after studying a particular chapter.
Rerate Products
Customer Review
Wednesday, March 23, 2011
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Review
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Feature
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-
Rerate Products
Customer Review
Wednesday, March 16, 2011
Thermal Contact Conductance (Mechanical Engineering Series)
Thermal Contact Conductance (Mechanical Engineering Series) Review
Thermal Contact Conductance (Mechanical Engineering Series) Feature
Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.
Rerate Products
Customer Review
Thursday, February 10, 2011
Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling
Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling Review
Fatigue under Thermal and Mechanical Loading: Mechanisms, Mechanics and Modelling Feature
This volume contains 50 contributions presented at the symposium `Fatigue under Thermal and Mechanical Loading'. The symposium addressed the mechanisms, mechanics and modelling of thermal and thermal-mechanical load effects on conventional and advanced structural materials. The proceedings provide an update of the research efforts in thermal and thermal-mechanical fatigue. The papers cover a wide range of materials, including metallic alloys from steels to advanced superalloy single crystals, ceramics as well as composites. Topics encompass recent developments in specimen and component testing techniques, mechanisms and mechanics of inelastic deformation, crack initiation and crack growth, as well as damage modelling for life-time prediction. The book is of interest to materials scientists, mechanical engineers and design engineers involved in the design of components for use at high temperatures.
Rerate Products
Customer Review
Sunday, December 12, 2010
CRC Handbook of Thermal Engineering (Handbook Series for Mechanical Engineering)
CRC Handbook of Thermal Engineering (Handbook Series for Mechanical Engineering) Review
CRC Handbook of Thermal Engineering (Handbook Series for Mechanical Engineering) Feature
To be successful in the international marketplace, corporations must have access to the latest developments and most recent experimental data. Traditional handbooks of heat transfer stress fundamental principles, analytical approaches to thermal problems, and elegant solutions to classical problems. The CRC Handbook of Thermal Engineering is not a traditional handbook. Engineers in industry need up-to-date, accessible information on the applications of heat and mass transfer-The CRC Handbook of Thermal Engineering provides it.
Peer reviewed articles-selected on the basis of their current relevance to the development of new products-provide in-depth treatment of applications in diverse fields, such as:
You'll find complete, up-to-date information on the latest development in the field, including:
A unique, one-stop resource for all your thermal engineering questions
From the basics of thermodynamics, fluid mechanics, and heat and mass transfer, to comprehensive treatment of current applications, the latest computational tools, to data tables for the properties of gases, liquids, and solids, The CRC Handbook of Thermal Engineering has it all!
Rerate Products
Customer Review
Thursday, November 4, 2010
Thermal Measurements in Electronics Cooling
Thermal Measurements in Electronics Cooling Review
Thermal Measurements in Electronics Cooling Feature
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic.
This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Rerate Products
Customer Review
Subscribe to:
Posts (Atom)