Structural Design Optimization Considering Uncertainties: Structures & Infrastructures Book , Vol. 1, Series, Series Editor: Dan M. Frangopol (Structures and Infrastructures)

Structural Design Optimization Considering Uncertainties: Structures & Infrastructures Book , Vol. 1, Series, Series Editor: Dan M. Frangopol (Structures and Infrastructures) Review

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Structural Design Optimization Considering Uncertainties: Structures & Infrastructures Book , Vol. 1, Series, Series Editor: Dan M. Frangopol (Structures and Infrastructures) Feature

Uncertainties play a dominant role in the design and optimization of structures and infrastructures. In optimum design of structural systems due to variations of the material, manufacturing variations, variations of the external loads and modelling uncertainty, the parameters of a structure, a structural system and its environment are not given, fixed coefficients, but random variables with a certain probability distribution. The increasing necessity to solve complex problems in Structural Optimization, Structural Reliability and Probabilistic Mechanics, requires the development of new ideas, innovative methods and numerical tools for providing accurate numerical solutions in affordable computing times.

This book presents the latest findings on structural optimization considering uncertainties. It contains selected contributions dealing with the use of probabilistic methods for the optimal design of different types of structures and various considerations of uncertainties. The first part is focused on reliability-based design optimization and the second part on robust design optimization. Comprising twenty-one, self-contained chapters by prominent authors in the field, it forms a complete collection of state-of-the-art theoretical advances and applications in the fields of structural optimization, structural reliability, and probabilistic computational mechanics. It is recommended to researchers, engineers, and students in civil, mechanical, naval and aerospace engineering and to professionals working on complicated costs-effective design problems.

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Proceedings of the 8th Intl Conference on Probabilistic Safety Assessment & Management: Book of Abstracts

Proceedings of the 8th Intl Conference on Probabilistic Safety Assessment & Management: Book of Abstracts Review

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Proceedings of the 8th Intl Conference on Probabilistic Safety Assessment & Management: Book of Abstracts Feature

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ASME Engineer's Data Book (Engineering Management)

ASME Engineer's Data Book (Engineering Management) Review

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ASME Engineer's Data Book (Engineering Management) Feature

A Complementary reference to the ASME Steam Tables software published in 1999, this volume is also based on the IAPWS Industrial Formulation 1997 for the Thermodynamic Properties of Water and Steam (IAPWS-IF97). International standards for water and steam properties are set by the International Association for the Properties of Water and Steam (IAPWS). This book, like the previous Steam Tables which date back to 1967, was produced by the efforts of the Properties of Steam Subcommittee of the ASME Research and Technology Committee on Water and Steam in Thermal Systems.

It contains chapters on Units and Conversions, Thermodynamic Properties, Transport Properties, and other Properties and Formulations, as well as Appendices on Thermodynamic Property Formulation and Transport Property Formulations. This book also contains 50 tables and charts for quick and easy reference.

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging)

Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) Review

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) Feature

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

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Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)

Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging) Review

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Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging) Feature

This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: (a) printed wiring boards and laminates; (b) various types of components and packages; (c) materials and processes; (d) fundamentals of reliability and relevant reliability enhancement methods, and (e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.

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