Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging Review

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging Feature

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.

Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.

Topics addressed in the book include, but are not limited to, the following:

physics and mechanics of polymer materials;

underfills;

electrically conductive adhesives;

plastic packages of IC devices;

lead free solders;

flip-chip packages;

portable electronics;

wirebond interconnects and metallurgical interconnections for harsh environments;

reliability and stress testing and accelerated life testing;

solder joint materials and technologies as well as lead-free solder materials and joints;

reliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components;

thermal phenomena in micro- and opto-electronic systems and thermal stresses;

adhesion problems and solutions;

thin film materials, physics and mechanics;

photorefractive materials and devices;

nanomaterials and nanotechnology;

multiphysics modeling and optimization technologies;

experimental methods and techniques;

testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others.

The book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems.

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Electronic Packaging: Design, Materials, Process, and Reliability

Electronic Packaging: Design, Materials, Process, and Reliability Review

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Electronic Packaging: Design, Materials, Process, and Reliability Feature

The ultimate, up-to-the-minute electronic packaging resource

The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need!

For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated.

With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging)

Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) Review

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) Feature

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

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Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)

Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging) Review

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Essentials of Electronic Packaging: A Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging) Feature

This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: (a) printed wiring boards and laminates; (b) various types of components and packages; (c) materials and processes; (d) fundamentals of reliability and relevant reliability enhancement methods, and (e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.

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