Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging Review

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials ... Physical Design / Reliability and Packaging Feature

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.

Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.

Topics addressed in the book include, but are not limited to, the following:

physics and mechanics of polymer materials;

underfills;

electrically conductive adhesives;

plastic packages of IC devices;

lead free solders;

flip-chip packages;

portable electronics;

wirebond interconnects and metallurgical interconnections for harsh environments;

reliability and stress testing and accelerated life testing;

solder joint materials and technologies as well as lead-free solder materials and joints;

reliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components;

thermal phenomena in micro- and opto-electronic systems and thermal stresses;

adhesion problems and solutions;

thin film materials, physics and mechanics;

photorefractive materials and devices;

nanomaterials and nanotechnology;

multiphysics modeling and optimization technologies;

experimental methods and techniques;

testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others.

The book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems.

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Random Vibration and Reliability of Composite Structures

Random Vibration and Reliability of Composite Structures Review

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Random Vibration and Reliability of Composite Structures Feature

In many applications composite structures are subjected to vibration which strongly influences service performance and life. This is the first systematic pre- sentation of the problems of and analytical techniques for random vibration and its effect on different types of composite structures.

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Electronic Packaging: Design, Materials, Process, and Reliability

Electronic Packaging: Design, Materials, Process, and Reliability Review

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Electronic Packaging: Design, Materials, Process, and Reliability Feature

The ultimate, up-to-the-minute electronic packaging resource

The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need!

For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated.

With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

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Safety Factors and Reliability: Friends or Foes?

Safety Factors and Reliability: Friends or Foes? Review

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Safety Factors and Reliability: Friends or Foes? Feature

Have you ever wondered where the safety factors come from? Why is it that deterministic analysis has reached a very sophisticated level, but in the end empirical factors are still needed? Is there a way to select them, rather than assigning them arbitrarily as is often done?
This book clearly shows that safety factors are closely related with the reliability of structures, giving yet another demonstration of Albert Einstein's maxim that "It is incomprehensible that Nature is comprehensible". The book shows that the safety factors are much more comprehensible if they are seen in a probabilistic context. Several definitions of the safety factors are given, analytical results on insightful numbers are presented, nonprobabilistic safety factors are shown, as well as their estimates derived by the inequalities of Bienayme, Markov, Chebushev and Camp-Meidell. A special chapter is devoted to important contributions by Japanese experts.
This volume will help to critically re-think the issue of safety factors, which can create a false feeling of security. The deterministic paradigm can be enhanced by incorporating probabilistic concepts wisely where they are needed without treating all variables as probabilistic ones. The book shows that there is a need of their integration rather than separation.
This book is intended for engineers, graduate students, lecturers and researchers.

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Engineering Design Reliability Handbook

Engineering Design Reliability Handbook Review

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Engineering Design Reliability Handbook Feature

Researchers in the engineering industry and academia are making important advances on reliability-based design and modeling of uncertainty when data is limited. Non deterministic approaches have enabled industries to save billions by reducing design and warranty costs and by improving quality.

Considering the lack of comprehensive and definitive presentations on the subject, Engineering Design Reliability Handbook is a valuable addition to the reliability literature. It presents the perspectives of experts from the industry, national labs, and academia on non-deterministic approaches including probabilistic, interval and fuzzy sets-based methods, generalized information theory, Dempster-Shaffer evidence theory, and robust reliability. It also presents recent advances in all important fields of reliability design including modeling of uncertainty, reliability assessment of both static and dynamic components and systems, design decision making in the face of uncertainty, and reliability validation. The editors and the authors also discuss documented success stories and quantify the benefits of these approaches.

With contributions from a team of respected international authors and the guidance of esteemed editors, this handbook is a distinctive addition to the acclaimed line of handbooks from CRC Press.

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